Pallets - Process Carrier Pallets

Pallets - Process Carrier Pallets

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Anti-Static superior adhesive properties High temperature minimal delamination

Anti-Static low IR heat absorption High temperature superior adhesive properties

Reflective white color low IR heat absorption High temperature minimal delamination

Keep critical components cool Cost effective solution

Low solder bath contamination Long lasting

No solder bath contamination Superior support for smaller parts

Low cracking and fragmenting Formulated for optimal thermal expansion characteristics

Anti-Static minimal chipping and cracking Formulated for even expansion characteristics

Anti-Static superior adhesive properties High temperature minimal delamination

Anti-Static low IR heat absorption High temperature superior adhesive properties

Reflective white color low IR heat absorption High temperature minimal delamination

Keep critical components cool Cost effective solution

Low solder bath contamination Long lasting

No solder bath contamination Superior support for smaller parts

Low cracking and fragmenting Formulated for optimal thermal expansion characteristics

Anti-Static minimal chipping and cracking Formulated for even expansion characteristics

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Test Electronics

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Conveyor Automation or Benchtop Bed of Nails Test Fixture.

Adjust Test Pins, Press Down Rods, and Tooling Pin Locations to fit any board.

Adjustable Press Down Rod feature installed. Bed of Nails Test Fixture.

200lbs of Force for In Circuit Test Application

Radio Frequency Shielding provides isolation of -60dB @ 4GHz.

Testing Boards in Panalized Form. Multiplexed Testing.

Adjustable Press Down Rods Feature installed.

Clear Lexan Press Plate with Press Down Rods.

Utilizes the well established Arduino Platform with thousands of plug in accessories available on the Market.

All Products

Process carrier pallets to carry the circuit boards through pick-n-place, IR reflow, gold wire bonding, epoxy dot encapsulating, and final fuctional test. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets. Process carrier pallets can be designed to carry your circuit boards through assembly, wash and final test.

Composite- High Carbon Process Carrier Pallets

High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.

Composite- Low Carbon Process Carrier Pallets

High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.

Composite- No Carbon Process Carrier Pallets

High Strength, high temperature, nonconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.

Metalic- Aluminum Process Carrier Pallets

Aluminum pallets can be used in solder paste IR reflow applications. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.

Metalic- Titanium Process Carrier Pallets

Titanium pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.

Metalic- Stainless Steel Process Carrier Pallets

Stainless Steel pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.

Ceramic- Silicon Process Carrier Pallets

Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, noniconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens.

Ceramic- Silicon Carbide Process Carrier Pallets

Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens.

Printer Nest for- Printer Nest Process Carrier Pallets

Aluminum printer nest designed to hold circuit boards while solder paste is applies

Wash Screen for- Wash Screen Process Carrier Pallets

Wash Screen clips over pallets for quick process washing without removing from pallets

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Enter Number of Test Pins for each side:
BOT	TOP	BAK	FNT	LFT	RGT

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Press Plate Features:
	Press Rods	Edge Press	Adjustable
BON Plate Features:
	Standard	QuickChange	Adjustable
Durability:
	50 Thousand	2 Million	10 Million
50K Operations = 2 years at 100 tests/day 2M Operations = 8 years at 1000 tests/day 10M Operations = 10 years at 4000 tests/day

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	Lever Latch		Panel Inserts
	Microcontroller		Mid Carrier Plate
	HV Shield		RF Shield

Pallet Material Antistatic / Reflectivity:
	No Carbon White	HighCarbon Black	Med Carbon Grey
Material Thickness:
	3mm	5mm
Hold Down Mechanism:
	None	SwivelLatch	TensionPins
Durability Until Delamination:
	12 Thousand	25 Thousand	50 Thousand
12K Cycles = 6 months at 100 cycles/day 25K Cycles = 1 year at 100 cycles/day 50K Cycles = 2 years at 100 cycles/day

Pallet Material Durability:
	Aluminum	Stainless	Titanium
Material Thickness:
	0.0625inch	0.090inch	0.125inch
Hold Down Mechanism:
	None	SwivelLatch	TensionPins

Pallet Material Conductivity:
	No Carbon NonConductive	Silicon Carbide Semiconductive
Material Thickness:
	2mm	3mm
Durability from Stress Pulveration Fractures:
	1 Million	1.2 Million	2 Million
1M Cycles Standard HS Machining 1.2M Cycles Bead Polished Finish 2M Cycles Polish & Heat Temper Treatment