Protector Lever Actuated Clamshell - Heavy Board & Heavy Board

Protector Lever Actuated Clamshell - Heavy Board & Heavy Board

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Low Cost Industrial Standard

High Accessibility High component densities

Medium Accessibility Required if component changes are predicted

Low Cost Industrial Standard

High Accessibility High component densities

Medium Accessibility Required if component changes are predicted

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6 Sided Final Assembly Functional Test Fixtures.

Android Tablet Touch Screen PCs Control the Arduino Based Test Fixtures via Bluetooth.

Arduino and Android Combined to form a versatile programmable touch screen test fixture.

Conveyor Automation or Benchtop Bed of Nails Test Fixture.

Adjust Test Pins, Press Down Rods, and Tooling Pin Locations to fit any board.

Adjustable Press Down Rod feature installed. Bed of Nails Test Fixture.

200lbs of Force for In Circuit Test Application

Radio Frequency Shielding provides isolation of -60dB @ 4GHz.

Testing Boards in Panalized Form. Multiplexed Testing.

Adjustable Press Down Rods Feature installed.

Clear Lexan Press Plate with Press Down Rods.

Utilizes the well established Arduino Platform with thousands of plug in accessories available on the Market.

All Bed of Nails Testers

Designed for testing heavy massive boards. Boards with heavy components like large transformers and inductors can destroy normal test fixtures. This design utilizes a 3 plate system where an internal lever actuated sub plate containing the test pins raises to probe the circuit board when the handle is pulled. Heavy boards can bend and break exposed test pins. Similarly large boards which need to be probed by very small delicate test pins can also benefit from this protected test fixture design. This fixture is recommended in situations where there is a high board mass to pin size ratio and pin protection is required. Front and rear panel modular inserts allow for easy updates and customizations to the user hardware interface.

Protector Press Rods- Press Down Rods Bed of Nails Tester

Press down rods are the old reliable industrial standard. Used successfully for many years, withstands the test of time, and are a low cost solution for larger simple boards with less dense component layouts.

Protector Edge Press- Edge Press Technology Bed of Nails Tester

Edge Press Technology provides high access to the top side of the board for troubleshooting, making adjustments and visual monitoring. Edge press is required where high component densities limit press down rod access. Edge press technology provides low board flex required by large high density component packages.

Protector Adjustable- Adjustable Press Plate Bed of Nails Tester

Adjustable press plates provide access to the top side of the board for troubleshooting, making adjustments, and visual monitoring. Adjustable press down rods placement is required when you know there are going to be component changes in the future.

Content

	Product information		Pricing information
	Technical support information	Other

Enter Number of Test Pins for each side:
BOT	TOP	BAK	FNT	LFT	RGT

Leave unused sides blank

Press Plate Features:
	Press Rods	Edge Press	Adjustable
BON Plate Features:
	Standard	QuickChange	Adjustable
Durability:
	50 Thousand	2 Million	10 Million
50K Operations = 2 years at 100 tests/day 2M Operations = 8 years at 1000 tests/day 10M Operations = 10 years at 4000 tests/day

	Lever Latch		Panel Inserts
	Microcontroller		Mid Carrier Plate
	HV Shield		RF Shield

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Pallet Material Antistatic / Reflectivity:
	No Carbon White	HighCarbon Black	Med Carbon Grey
Material Thickness:
	3mm	5mm
Hold Down Mechanism:
	None	SwivelLatch	TensionPins
Durability Until Delamination:
	12 Thousand	25 Thousand	50 Thousand
12K Cycles = 6 months at 100 cycles/day 25K Cycles = 1 year at 100 cycles/day 50K Cycles = 2 years at 100 cycles/day

Pallet Material Durability:
	Aluminum	Stainless	Titanium
Material Thickness:
	0.0625inch	0.090inch	0.125inch
Hold Down Mechanism:
	None	SwivelLatch	TensionPins

Pallet Material Conductivity:
	No Carbon NonConductive	Silicon Carbide Semiconductive
Material Thickness:
	2mm	3mm
Durability from Stress Pulveration Fractures:
	1 Million	1.2 Million	2 Million
1M Cycles Standard HS Machining 1.2M Cycles Bead Polished Finish 2M Cycles Polish & Heat Temper Treatment