Aluminum pallets can be used in solder paste IR reflow applications. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
Test Electronics
Metalic Process Carrier Pallets
All PalletsAluminum pallets can be used in solder paste IR reflow applications. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
Titanium pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
Stainless Steel pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
- High strength to withstand operator abuse and repeated use without damage.
- High temperature compatibility allowing frequent cycles through IR reflow soldering without warping or delamination.
- Dimensional stability so that fit and alignment are the same time after time.
- Chemical resistance which provides long pallet life even through rigorous cleaning processes.
- Consistent conductivity on the surface and through the sheet to preserve sensitive components.
- Low heat absorption allowing the machines to run cooler and faster.
- Special pin fabrication and insertion techniques prevent loosening of circuit board alignment pins.
- White lettering provides easy to read part number labeling.
The pallet material is impregnated with a conductive carbon which acts to prevent static damage. Standard machining techniques can loosen and wash this protective carbon away from the surface areas where it is most needed. Test Electronics prevents this by using a high speed spindle speed of 30,000 rpm. This high speed promotes cleaner cutting of the fibers and minimizes breaking up and washing away the conductive carbon composite material. After the machining process, the pallet is then micro bead polished to a gloss ensuring that the fibers and carbon are blended smoothly at the surface for optimum static protection.
Special high speed cutting and micro bead polishing techniques which enhance the surface conductivity also allows the use of lower carbon content pallet material. This lightens the color and reduces heat absorption allowing the reflow soldering machines to run cooler and faster.
Other techniques for even higher reliability are as shown above:
- Swaged pins.
- Grove and glued pins (high temperature epoxy).
- Cap captured pins.
Common pin styles available are:
- Straight pins.
- Step pins.
- Flanged Step Pins.
Common pin styles available are:
- Round head for standard through holes.
- Diamond head for slotted holes.
- Elongated round head for precision aligning slotted holes.
- No Carbon is non-conductive.
- High Carbon is semi-conductive.
- Low Carbon is both semi-conductive and optically reflective.
Machining Specifications | |
Pinning accuracy | ±0.0005" |
Perimeter Cut accuracy | ±0.0005" |
Surface roughness | ANSI-16 or better |
Material Specifications | Aluminum | Titanium | Stainless Steel |
Surface Resistivity (Ω/in²) | 1000 | 0 | 0 |
ESD Safe | YES | YES | YES |
Density lb/in³ | 0.09 | 0.16 | 0.28 |
Water Absorption % | 0 | 0 | 0 |
Avg. CTE (para) K-1 | 0 | 0 | 0 |
Avg. CTE (perp) K-1 | 0 | 0 | 0 |
Flexural Strength (psi) | 100000 | 240000 | 340000 |
Modulus in Flexure (psi) | 0 | 0 | 0 |
Izod Impact Strength (ft-lb/in) | 10 | 12 | 14 |
Thermal Conductivity (W/(m·K)) | 235 | 21 | 16 |
Surface Operating Temp °C | 500 | 1400 | 1200 |
Chemical Resistance | Very Good | Very Good | Very Good |
Barcol Hardness | 0 | 0 | 0 |