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Test Electronics



Pallets- Process Carrier PalletsAll Products

Process carrier pallets to carry the circuit boards through pick-n-place, IR reflow, gold wire bonding, epoxy dot encapsulating, and final fuctional test. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.  Process carrier pallets can be designed to carry your circuit boards through assembly, wash and final test.
Composite-  High Carbon  Process Carrier Pallets

Anti-Static superior adhesive properties    High temperature minimal delamination

High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
Composite-  Low Carbon  Process Carrier Pallets

Anti-Static low IR heat absorption    High temperature superior adhesive properties

High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
Composite-  No Carbon  Process Carrier Pallets

Reflective white color low IR heat absorption    High temperature minimal delamination

High Strength, high temperature, nonconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
Metalic-  Aluminum  Process Carrier Pallets

Keep critical components cool     Cost effective solution

Aluminum pallets can be used in solder paste IR reflow applications. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.
Metalic-  Titanium  Process Carrier Pallets

Low solder bath contamination    Long lasting

Titanium pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.
Metalic-  Stainless Steel  Process Carrier Pallets

No solder bath contamination    Superior support for smaller parts

Stainless Steel pallets used in wave solder will not contaminate the solder bath. The pallet is designed for use as circuit board and flex circuit carrying pallets for wave solder machines and solder reflow ovens.
Ceramic-  Silicon  Process Carrier Pallets

Low cracking and fragmenting    Formulated for optimal thermal expansion characteristics

Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, noniconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens.
Ceramic-  Silicon Carbide  Process Carrier Pallets

Anti-Static minimal chipping and cracking    Formulated for even expansion characteristics

Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens.
Printer Nest for-  Printer Nest  Process Carrier Pallets

   

Aluminum printer nest designed to hold circuit boards while solder paste is applies
Wash Screen for-  Wash Screen  Process Carrier Pallets

   

Wash Screen clips over pallets for quick process washing without removing from pallets
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We hope to beat or meet your cost expectations.

Enter circuit board size:
Select Number of Sides to Probe:
Enter Number of Test Pins for each side:
BOT TOP BAK FNT LFT RGT
Leave unused sides blank

Press Plate Features:
Press Rods Edge Press Adjustable
BON Plate Features:
Standard QuickChange Adjustable
Durability:
50 Thousand 2 Million 10 Million
  50K Operations = 2 years at 100 tests/day 2M Operations = 8 years at 1000 tests/day 10M Operations = 10 years at 4000 tests/day

Additional Features:
Lever Latch Panel Inserts
Microcontroller Mid Carrier Plate
HV Shield RF Shield
Estimate Price and Availability
Estimate Price and Availability
Enter carrier pallet size:
Select Base Material Type:
Pallet Material   Antistatic / Reflectivity:
No Carbon
White
HighCarbon
Black
Med Carbon
Grey
Material Thickness:
3mm 5mm
Hold Down Mechanism:
None SwivelLatch TensionPins
Durability Until Delamination:
12 Thousand 25 Thousand 50 Thousand
  12K Cycles = 6 months at 100 cycles/day 25K Cycles = 1 year at 100 cycles/day 50K Cycles = 2 years at 100 cycles/day

Pallet Material Durability:
Aluminum Stainless Titanium
Material Thickness:
0.0625inch 0.090inch 0.125inch
Hold Down Mechanism:
None SwivelLatch TensionPins

Additional Features:
Anodize Acid Etch
BeadPolish HeatTreat
Pallet Material   Conductivity:
No Carbon
NonConductive
Silicon Carbide
Semiconductive
Material Thickness:
2mm 3mm
Durability from Stress Pulveration Fractures:
1 Million 1.2 Million 2 Million
  1M Cycles Standard HS Machining 1.2M Cycles Bead Polished Finish 2M Cycles Polish & Heat Temper Treatment

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