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Test Electronics



Rand R&D Clamshell- Modular Design & Easy Upgrade abilityAll Bed of Nails Testers

Designed for Research & Development and Pre-Production environments to support often reoccurring product design changes. The primary design focus for this fixture is ease in applying engineering changes and resilience to the abuse of applying multiple engineering changes without damage. In R&D and Preproduction, design changes and updates can occur every week. This Rand fixture, unlike normal test fixtures was designed to be easily taken apart and updated. Constantly disassembling modifying and reassembling a normal bed of nails test fixture over and over again can be a major disaster with wire breakage and test pin bending issues. The modular design of the Rand fixture allows for easy disassembly without flexing the wires or risk of bending test pins. The Rand fixture provides complete easy access for multiple updates requiring machining, drilling and wiring changes.

Rand Press Rods- Press Down Rods Bed of Nails Tester

Low Cost    Industrial Standard

Press down rods are the old reliable industrial standard. Used successfully for many years, withstands the test of time, and are a low cost solution for larger simple boards with less dense component layouts.
Rand Edge Press- Edge Press Technology Bed of Nails Tester

High Accessibility    High component densities

Edge Press Technology provides high access to the top side of the board for troubleshooting, making adjustments and visual monitoring. Edge press is required where high component densities limit press down rod access. Edge press technology provides low board flex required by large high density component packages.
Rand Adjustable- Adjustable Press Plate Bed of Nails Tester

Medium Accessibility    Required if component changes are predicted

Adjustable press plates provide access to the top side of the board for troubleshooting, making adjustments, and visual monitoring. Adjustable press down rods placement is required when you know there are going to be component changes in the future.

 

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Enter circuit board size:
Select Number of Sides to Probe:
Enter Number of Test Pins for each side:
BOT TOP BAK FNT LFT RGT
Leave unused sides blank

Press Plate Features:
Press Rods Edge Press Adjustable
BON Plate Features:
Standard QuickChange Adjustable
Durability:
50 Thousand 2 Million 10 Million
  50K Operations = 2 years at 100 tests/day 2M Operations = 8 years at 1000 tests/day 10M Operations = 10 years at 4000 tests/day

Additional Features:
Lever Latch Panel Inserts
Microcontroller Mid Carrier Plate
HV Shield RF Shield
Estimate Price and Availability
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Enter carrier pallet size:
Select Base Material Type:
Pallet Material   Antistatic / Reflectivity:
No Carbon
White
HighCarbon
Black
Med Carbon
Grey
Material Thickness:
3mm 5mm
Hold Down Mechanism:
None SwivelLatch TensionPins
Durability Until Delamination:
12 Thousand 25 Thousand 50 Thousand
  12K Cycles = 6 months at 100 cycles/day 25K Cycles = 1 year at 100 cycles/day 50K Cycles = 2 years at 100 cycles/day

Pallet Material Durability:
Aluminum Stainless Titanium
Material Thickness:
0.0625inch 0.090inch 0.125inch
Hold Down Mechanism:
None SwivelLatch TensionPins

Additional Features:
Anodize Acid Etch
BeadPolish HeatTreat
Pallet Material   Conductivity:
No Carbon
NonConductive
Silicon Carbide
Semiconductive
Material Thickness:
2mm 3mm
Durability from Stress Pulveration Fractures:
1 Million 1.2 Million 2 Million
  1M Cycles Standard HS Machining 1.2M Cycles Bead Polished Finish 2M Cycles Polish & Heat Temper Treatment

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